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Effect of Test Conditions on Electromigration Reliability of Sn–Ag–Cu Flip-Chip Solder Interconnects
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The high-temperature operation life test (HTOL) was conducted in this paper to study electromigration phenomena of solder interconnects in a flip-chip package assembly. We examined the fatigue ...
Electromigration Reliability of 96.5Sn–3Ag–0.5Cu Flip-Chip Solder Joints With Au/Ni/Cu or Cu Substrate Pad Metallization
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Designed experiments were conducted in this paper to study the effect of Au/Ni/Cu or Cu substrate pad metallization on the electromigration reliability of 96.5Sn–3Ag–0.5Cu flip-chip solder joints ...